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Search Results - Herfurth, Patrick
Search Results - Herfurth, Patrick
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Ultrathin Body InAlN/GaN HEMTs for High-Temperature (600 ^ ) Electronics
by
Herfurth, P.
,
Maier, D.
,
Lugani, L.
,
Carlin, Jean-Francois
,
Rosch, R.
,
Men, Y.
,
Grandjean, N.
,
Kohn, E.
Published in
IEEE electron device letters
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Ultrathin InAlN/GaN heterostructures on sapphire for high on/off current ratio high electron mobility transistors
by
Lugani, Lorenzo
,
Carlin, Jean-François
,
Py, Marcel A.
,
Martin, Denis
,
Rossi, Francesca
,
Salviati, Giancarlo
,
Herfurth, Patrick
,
Kohn, Erhard
,
Bläsing, Jürgen
,
Krost, Alois
,
Grandjean, Nicolas
Published in
Journal of applied physics
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GaN-on-insulator technology for high-temperature electronics beyond 400 °C
by
Herfurth, Patrick
,
Maier, David
,
Men, Yakiv
,
Rösch, Rudolf
,
Lugani, Lorenzo
,
Carlin, Jean-Francois
,
Grandjean, Nicolas
,
Kohn, Erhard
Published in
Semiconductor science and technology
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GaN-on-insulator technology for high-temperature electronics beyond 400 °C: Gallium nitride electronics
by
HERFURTH, Patrick
,
MAIER, David
,
MEN, Yakiv
,
RÖSCH, Rudolf
,
LUGANI, Lorenzo
,
CARLIN, Jean-Francois
,
GRANDJEAN, Nicolas
,
KOHN, Erhard
Published in
Semiconductor science and technology
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Reliability investigation of the degradation of the surface passivation of InAlN/GaN HEMTs using a dual gate structure
by
Ostermaier, Clemens
,
Lagger, Peter
,
Alomari, Mohammed
,
Herfurth, Patrick
,
Maier, David
,
Alexewicz, Alexander
,
Forte-Poisson, Marie-Antoinette di
,
Delage, Sylvain L.
,
Strasser, Gottfried
,
Pogany, Dionyz
,
Kohn, Erhard
Published in
Microelectronics and reliability
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The Assembly Investigation of a Multi-chip to PCB Flip-chip Package Using Cu Pillar Bumps
by
Cao, Zhibo
,
Lehmann, Jens
,
Heusdens, Bruno
,
Durmaz, Emre Can
,
Kruger, Patrick
,
Wietstruck, Matthias
,
Herfurth, Norbert
,
Adesunkanmi, Awwal Adeniyi
,
Carta, Corrado
,
Kaynak, Mehmet
Published in
IEEE transactions on components, packaging, and manufacturing technology (2011)
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Ieee Electron Device Letters
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Thin Buffer
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600 ^{\Circ}{\Rm C}
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Au-Cu Thermocompression Bonding
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C2 Thermocompression Bonding
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