Search Results - HUNGCHUNG LI

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  1. 1
    A Novel Wafer-Level Hermetic Packaging for MEMS Devices

    A Novel Wafer-Level Hermetic Packaging for MEMS Devices by TSOU, Chingfu, HUNGCHUNG LI, CHANG, Hsing-Cheng

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  2. 2
    Electroplated nickel micromachined probes with out-of-plane predeformation for IC chip testing

    Electroplated nickel micromachined probes with out-of-plane predeformation for IC chip testing by Tsou, Chingfu, Huang, Shuen-Lung, Li, Hungchung, Lai, Tengshian

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  3. 3
    Bending Characterization of Electroplated Nickel Microbeams

    Bending Characterization of Electroplated Nickel Microbeams by Tsou, Chingfu, Li, Hungchung, Lai, Tenghsien, Hsu, Changchun, Feng, Weileun

    Published in Sensors and materials
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