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Guan, Yunhui
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Search Results - Guan, Yunhui
Showing
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10
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Guan, Yunhui
'
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1
Study on Liquefaction Resistance of Pile Group by Shaking Table Test
by
Zhang, Cong
,
Feng, Zhongju
,
Guan, Yunhui
,
Chen, Huiyun
,
Wang, Fuchun
,
Xu, Boxi
Published in
Advances in civil engineering
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2
An oxygen vacancy-rich ZnO layer on garnet electrolyte enables dendrite-free solid state lithium metal batteries
by
Wei, Ying
,
Xu, Henghui
,
Cheng, Hang
,
Guan, Weixin
,
Yang, Jiayi
,
Li, Zhen
,
Huang, Yunhui
Published in
Chemical engineering journal (Lausanne, Switzerland : 1996)
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3
Diamond turning of freeform surfaces using non-zero rake angle tools
by
Zuo, Chengming
,
Meng, Guangwei
,
Zhou, Xiaoqin
,
Liu, Qiang
,
Jiang, Shan
,
Zhang, Xu
,
Xu, Pengzi
,
Zhang, Yunhui
,
Zhang, Xiuzhi
,
Yan, Guan
Published in
International journal of advanced manufacturing technology
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4
Oxidation induced mechanisms during directed energy deposition additive manufactured titanium alloy builds
by
Iantaffi, Caterina
,
Leung, Chu Lun Alex
,
Chen, Yunhui
,
Guan, Shaoliang
,
Atwood, Robert C.
,
Lertthanasarn, Jedsada
,
Pham, Minh-Son
,
Meisnar, Martina
,
Rohr, Thomas
,
Lee, Peter D.
Published in
Additive manufacturing letters
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5
Fabrication, Characterization, and Simulation of a Low-Cost TSV Integration Without Front-Side CMP Process
by
Guan, Yong
,
Zhu, Yunhui
,
Ma, Shenglin
,
Zeng, Qinghua
,
Chen, Jing
,
Jin, Yufeng
Published in
IEEE transactions on semiconductor manufacturing
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6
Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration
by
Sun, Xin
,
Fang, Runiu
,
Zhu, Yunhui
,
Zhong, Xiao
,
Bian, Yuan
,
Guan, Yong
,
Miao, Min
,
Chen, Jing
,
Jin, Yufeng
Published in
Microelectronic engineering
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7
Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration
by
Guan, Yong
,
Zhu, Yunhui
,
Ma, Shenglin
,
Zeng, Qinghua
,
Chen, Jing
,
Jin, Yufeng
Published in
IEEE transactions on components, packaging, and manufacturing technology (2011)
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8
A wafer level through-stack-via integration process with one-time bottom-up copper filling
by
Yunhui Zhu
,
Shenglin Ma
,
Xin Sun
,
Runiu Fang
,
Xiao Zhong
,
Yuan Bian
,
Yong Guan
,
Jing Chen
,
Min Miao
,
Yufeng Jin
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9
Mechanical and electrical reliability assessment of bump-less wafer-on-wafer integration with one-time bottom-up TSV filling
by
Guan, Yong
,
Zhu, Yunhui
,
Zeng, Qinghua
,
Ma, Shenglin
,
Su, Fei
,
Bian, Yuan
,
Zhong, Xiao
,
Chen, Jing
,
Jin, Yufeng
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10
Characterizations of Nanosilver Joints by Rapid Sintering at Low Temperature for Power Electronic Packaging
by
Lu, Guan-Quan
,
Li, Wanli
,
Mei, Yunhui
,
Chen, Gang
,
Li, Xin
,
Chen, Xu
Published in
IEEE transactions on device and materials reliability
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10
Peer Reviewed
7
Format
Articles
7
Conference Proceedings
2
Magazinearticle
1
Journal Title
Additive Manufacturing Letters
1
Advances In Civil Engineering
1
Chemical Engineering Journal
1
Ieee Transactions On Components, Packaging, And Manufacturing Technology
1
Ieee Transactions On Device And Materials Reliability
1
Ieee Transactions On Semiconductor Manufacturing
1
International Journal Of Advanced Manufacturing Technology
1
Microelectronic Engineering
1
Subjects
Engineering
Science & Technology
10
Technology
10
Engineering, Electrical & Electronic
6
Engineering, Manufacturing
4
Silicon
4
Through-Silicon Vias
4
Through Silicon Via
3
Resistance
3
Physics, Applied
3
Physics
3
Physical Sciences
3
Filling
3
Bonding
3
Materials Science
2
Materials Science, Multidisciplinary
2
Stacking
2
Surface Treatment
2
Temperature Measurement
2
3-D Packaging
1
Year of Publication
From:
To:
Source
Science Citation Index Expanded (Web Of Science)
7
Sciencedirect
3
Ieee Electronic Library (Iel) Journals
3
Ieee Xplore
3
Ieee Xplore All Conference Series
2
Doaj Directory Of Open Access Journals
2
Road: Directory Of Open Access Scholarly Resources
2
Ezb Free E-Journals
2
Proquest Publicly Available Content Database
1
Springer Nature - Connect Here First To Enable Access
1
Hindawi Publishing
1
Springer Link Contemporary
1
Backfile Package - Computer Science (Legacy) [Ycs]
1
Elsevier Sd Backfile Engineering And Technology
1
Backfile Package - Materials Science
1
Backfile Package - Physics General (Legacy) [Ypa]
1
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