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Search Results - Goossen, R.L.
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High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS
by
Lentine, A.L.
,
Goossen, K.W.
,
Walker, J.A.
,
Chirovsky, L.M.F.
,
D'Asaro, L.A.
,
Hui, S.P.
,
Tseng, B.J.
,
Leibenguth, R.E.
,
Cunningham, J.E.
,
Jan, W.Y.
,
Kuo, J.-M.
,
Dahringer, D.W.
,
Kossives, D.P.
,
Bacon, D.D.
,
Livescu, G.
,
Morrison, R.L.
,
Novotny, R.A.
,
Buchholz, D.B.
Published in
IEEE journal of selected topics in quantum electronics
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Large array of GaAs modulators and detectors flip-chip solder bonded to silicon CMOS using InGaP as the selective etch stop for GaAs substrate removal
by
Kuo, J.M.
,
Wang, Y.C.
,
Goossen, K.W.
,
Chirovsky, L.M.F.
,
Hui, S.P.
,
Tseng, B.T.
,
Walker, J.
,
Lentine, A.L.
,
Leibenguth, R.E.
,
Livescu, G.
,
Jan, W.Y.
,
Cunningham, J.E.
,
D'Asaro, L.A.
,
Ron, A.
,
Dahringer, D.
,
Kossives, D.
,
Bacon, D.D.
,
Morrison, R.L.
,
Novotny, R.A.
,
Buchholz, D.B.
,
Mayo, W.E.
Published in
Journal of crystal growth
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Optoelectronic VLSI switching chip with greater than 4000 optical I/O based on flip chip bonding of GaAs-AlGaAs MQW modulators and detectors to silicon CMOS
by
Lentine, A.L.
,
Goossen, K.W.
,
Walker, J.A.
,
Chirovsky, L.M.F.
,
D'Asaro, L.A.
,
Hui, S.P.
,
Tseng, B.T.
,
Leibenguth, R.E.
,
Cunningham, J.E.
,
Jan, W.Y.
,
Kuo, J.M.
,
Dahringer, D.
,
Kossives, D.
,
Bacon, D.D.
,
Livescu, G.
,
Morrison, R.L.
,
Novotny, R.A.
,
Buchholz, D.B.
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Conference Proceeding
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Ieee Journal Of Selected Topics In Quantum Electronics
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Journal Of Crystal Growth
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High Speed Optical Techniques
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Optical Modulation
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Communication Switching
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Flip Chip
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Flip-Chip Solder Bonding
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High Speed Integrated Circuits
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Ieee Electronic Library (Iel) Conference Proceedings
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