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Search Results - Garrou, P.E.
Search Results - Garrou, P.E.
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Transfer printing: An approach for massively parallel assembly of microscale devices
by
Bower, C.A.
,
Menard, E.
,
Garrou, P.E.
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A cool package for the 90s
by
Knudsen, A.K.
,
Garrou, P.E.
Published in
IEEE circuits and devices magazine
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MCM-LD: large area processing using photosensitive-BCB
by
Strandjord, A.J.G.
,
Garrou, P.E.
,
Heistand, R.H.
,
Tessier, T.G.
Published in
IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
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One Mask Process For Stress-buffer And Passivation Applications Using Photosensitive Benzocyclobutene
by
Strandjord, A.J.G.
,
Rogers, W.B.
,
Ida, Y.
,
Shiau, S.
,
Moyer, E.S.
,
Scheck, D.M.
,
DeVellis, R.R.
,
Garrou, P.E.
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Processing, transfer solder bumping, chip attachment and testing of a thin film Cu/Photo-BCB MCM-D
by
Ida, Y.
,
Garrou, P.E.
,
Strandjord, A.J.G.
,
Cummings, S.L.
,
Boyd Rogers, W.
,
Berry, M.J.
,
Kisting, S.R.
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Rapid thermal curing of BCB dielectric
by
Garrou, P.E.
,
Heistand, R.H.
,
Dibbs, M.G.
,
Manial, T.A.
,
Mohler, C.E.
,
Stokich, T.M.
,
Townsend, P.H.
,
Adema, G.M.
,
Berry, M.J.
,
Turlik, I.
Published in
IEEE transactions on components, hybrids, and manufacturing technology
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Cost Implications of Large Area MCM Processing
by
Frye, D.C.
,
Skinner, M.P.
,
Heistand, R.H.
,
Garrou, P.E.
,
Tessier, T.G.
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A photosensitive-BCB on laminate technology (MCM-LD)
by
Strandjord, A.J.G.
,
Heistand, R.H.
,
Bremmer, J.N.
,
Garrou, P.E.
,
Tessier, T.G.
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Propylenamines by cobalt-catalyzed nitrile hydrogenations
by
Duquette, L. G
,
Garrou, P. E
,
Hartwell, G. E
,
Kaufman, J. A
Published in
Industrial & engineering chemistry product research and development
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Rapid thermal curing of BCB dielectric
by
Garrou, P.E.
,
Heistand, R.H.
,
Dibbs, M.
,
Manial, T.A.
,
Mohler, C.
,
Stokich, T.
,
Townsend, P.H.
,
Adema, G.M.
,
Berry, M.J.
,
Turlik, I.
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Photosensitive benzocyclobutene for stress-buffer and passivation applications (one mask manufacturing process)
by
Strandjord, A.J.G.
,
Rogers, W.B.
,
Ida, Y.
,
DeVeillis, R.R.
,
Shiau, S.
,
Moyer, E.S.
,
Scheck, D.M.
,
Garron, P.E.
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Stress-buffer and passivation processes for Si and GaAs IC's and passive components using photosensitive BCB: process technology and reliability data
by
Ganrou, P.E.
,
Rogers, W.B.
,
Scheck, D.M.
,
Strandjord, A.J.G.
,
Ida, Y.
,
Ohba, K.
Published in
IEEE transactions on advanced packaging
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