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High Temperature Resistant Packaging Technology for SiC Power Module by Using Ni Micro-Plating Bonding
by
Tatsumi, Kohei
,
Morisako, Isamu
,
Wada, Keiko
,
Fukuomori, Minoru
,
Iizuka, Tomonori
,
Sato, Nobuaki
,
Shimizu, Koji
,
Ueda, Kazutoshi
,
Hikita, Masayuki
,
Kamimura, Rikiya
,
Kawanabe, Naoki
,
Sugiura, Kazuhiko
,
Tsuruta, Kazuhiro
,
Toda, Keiji
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Conference Proceedings
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Bonding
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Cu Lead
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Engineering
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Engineering, Electrical & Electronic
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Hev
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Inverter
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Inverters
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Lead
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Lead Frame
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Micro-Plating
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Mos-Fet
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Mosfet
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Multichip Modules
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Nickel
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Nmpb
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Plating
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Power Module
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Sbd
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Science & Technology
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Sic
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