Search Results - Franiatte, R.
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Hybrid PMUT realized using an innovative "Piezo-in-flex" technology
Conference Proceeding -
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Test structures for the evaluation of 3D chip interconnection schemes
Conference Proceeding -
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Underfilling techniques comparison in 3D CtW stacking approach
Conference Proceeding -
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Reliability Aspects of Microinsert Based Interconnection Technologies
Conference Proceeding -
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