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Search Results - Canaperi, Donald F
Search Results - Canaperi, Donald F
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Molecular Interactions in Copper Chemical Mechanical Planarization: A Phenomenological Study
by
Krishnan, Mahadevaiyer
,
Canaperi, Donald F.
,
Rangarajan, Sarukkai K.
Published in
ECS journal of solid state science and technology
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Electron and hole mobility enhancement in strained SOI by wafer bonding
by
Lijuan Huang
,
Chu, J.O.
,
Goma, S.A.
,
D'Emic, C.P.
,
Koester, S.J.
,
Canaperi, D.F.
,
Mooney, P.M.
,
Cordes, S.A.
,
Speidell, J.L.
,
Anderson, R.M.
,
Wong, H.-S.P.
Published in
IEEE transactions on electron devices
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BEOL Dielectric Processing for Cu-Low k Nano Interconnect- Impact of Plasma CVD Initial Transient Phenomena (ITP)
by
Nguyen, Son van
,
Shobha, Hosadurga k
,
Haigh, Thomas J
,
Priyadarshini, Deepika
,
Canaperi, Donald F
Published in
ECS transactions
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Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect
by
Nguyen, Son van
,
Shobha, Hosadurga k
,
Haigh, Thomas J
,
Yao, Yiping
,
Tai, Leo
,
Cohen, Stephan A
,
Shaw, Thomas M
,
Hu, Chao-kun
,
Liniger, Eric
,
Virwani, Kumar
,
Kellock, Andrew J
,
Canaperi, Donald F
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Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects
by
Nguyen, Son van
,
Priyadarshini, Deepika
,
Shobha, Hosadurga k
,
Haigh, Thomas J
,
Hu, Chao-kun
,
Cohen, Stephan A
,
Liniger, Eric
,
Shaw, Thomas M
,
Adams, Edward D
,
Burnham, Jay
,
Madan, Anita
,
Klymko, Nancy R
,
Parks, Christopher
,
Yang, Daewon
,
Molis, Steven E
,
Lin, Y
,
Bonilla, Griselda
,
Grill, Alfred
,
Edelstein, Daniel
,
Canaperi, Donald F
,
Xia, Li-Qun
,
Reiter, Steven
,
Balseanu, Mihaela
,
Shek, Mei-Yee
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Silicon Carrier with Deep Through-Vias, Fine Pitch Wiring and Through Cavity for Parallel Optical Transceiver
by
Patel, C.S.
,
Tsang, C.K.
,
Schuster, C.
,
Doany, F.E.
,
Nyikal, H.
,
Baks, C.W.
,
Budd, R.
,
Buchwalter, L.P.
,
Andry, P.S.
,
Canaperi, D.F.
,
Edelstein, D.C.
,
Horton, R.
,
Knickerbocker, J.U.
,
Krywanczyk, T.
,
Kwark, Y.H.
,
Kwietniak, K.T.
,
Magerlein, J.H.
,
Rosner, J.
,
Sprogis, E.
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Edge-curling-wall discontinuities and interactions with Bloch walls in easy-axis Permalloy
by
Herman, D.A.
,
Trouilloud, P.L.
,
Argyle, B.E.
,
Petek, B.
,
Romankiw, L.T.
,
Bezama, J.S.
,
Rath, D.L.
,
Canaperi, D.F.
,
Komsa, M.L.
Published in
IEEE transactions on magnetics
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Copper contact metallization for 22 nm and beyond
by
Soon-Cheon Seo
,
Chih-Chao Yang
,
Chun-Chen Yeh
,
Haran, B.
,
Horak, D.
,
Fan, S.
,
Koburger, C.
,
Canaperi, D.
,
Papa Rao, S.S.
,
Monsieur, F.
,
Knorr, A.
,
Kerber, A.
,
Chao-Kun Hu
,
Kelly, J.
,
Tuan Vo
,
Cummings, J.
,
Smalleya, M.
,
Petrillo, K.
,
Mehta, S.
,
Schmitz, S.
,
Levin, T.
,
Dae-Guy Park
,
Stathis, J.H.
,
Spooner, T.
,
Paruchuri, V.
,
Wynne, J.
,
Edelstein, D.
,
McHerron, D.
,
Doris, B.
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