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Search Results - Alshwawreh, N.
Search Results - Alshwawreh, N.
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Role of Organic Additives in the Fabrication of Micro Copper Rods by Localized Electrochemical Deposition
by
Alshwawreh, N
,
Hussien, O
,
Khanfar, M
Published in
IOP conference series. Materials Science and Engineering
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Resistivity-microstructure correlation of self-annealed electrodeposited copper thin films
by
Alshwawreh, N.
,
Militzer, M.
,
Bizzotto, D.
,
Kuo, J.C.
Published in
Microelectronic engineering
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Recrystallization of Electrodeposited Copper Thin Films During Annealing
by
Alshwawreh, N.
,
Militzer, M.
,
Bizzotto, D.
Published in
Journal of electronic materials
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Accelerated Recrystallization in Electrodeposited Dual-Layer Copper Thin Films
by
Alshwawreh, N.
,
Militzer, M.
,
Bizzotto, D.
,
Kuo, J. C.
Published in
Journal of the Electrochemical Society
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Iop Conference Series. Materials Science And Engineering
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Iop Conference Series: Materials Science And Engineering
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Journal Of Electronic Materials
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Journal Of The Electrochemical Society
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Subjects
Electrodeposition
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Materials Science
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Physical Sciences
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Science & Technology
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Technology
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Annealing
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Applied Sciences
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Cross-Disciplinary Physics: Materials Science; Rheology
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Electrodeposition, Electroplating
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Engineering, Electrical & Electronic
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Exact Sciences And Technology
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Methods Of Deposition Of Films And Coatings; Film Growth And Epitaxy
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Physics
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Physics, Applied
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Recrystallization
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Self-Annealing
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Thin Films
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Additives
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Science Citation Index Expanded (Web Of Science)
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Institute Of Physics Iop Science Extra
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Institute Of Physics:jisc Collections:iop Publishing Read And Publish 2024-2025 (Reading List)
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Backfile Package - Computer Science (Legacy) [Ycs]
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