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Search Results - AGRAHARAM, Sairam
Search Results - AGRAHARAM, Sairam
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Plasma chemistry in fluorocarbon film deposition from pentafluoroethane/argon mixtures
by
Agraharam, Sairam
,
Hess, Dennis W.
,
Kohl, Paul A.
,
Bidstrup Allen, Sue A.
Published in
Journal of vacuum science & technology. A, Vacuum, surfaces, and films
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Thermal stability of fluorocarbon films deposited from pentafluoroethane/argon plasmas
by
AGRAHARAM, S
,
HESS, D. W
,
KOHL, P. A
,
ALLEN, S. A. B
Published in
Journal of the Electrochemical Society
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Electrical properties and temperature-humidity studies of fluorocarbon films deposited from pentafluoroethane/argon plasmas
by
AGRAHARAM, Sairam
,
HESS, Dennis W
,
KOHL, Paul A
,
ALLEN, Sue Ann
Published in
Journal of the Electrochemical Society
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Moisture absorption studies of fluorocarbon films deposited from pentafluoroethane and octafluorocyclobutane plasmas
by
TANIKELLA, Ravindra V
,
AGRAHARAM, Sairam
,
BIDSTRUP ALLEN, Sue A
,
HESS, Dennis W
,
KOHL, Paul A
Published in
Journal of electronic materials
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Comparison of plasma chemistries and structure-property relationships of fluorocarbon films deposited from octafluorocyclobutane and pentafluoroethane monomers
by
Agraharam, Sairam
,
Hess, Dennis W.
,
Kohl, Paul A.
,
Bidstrup Allen, Sue Ann
Published in
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
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Copper die bumps (first level interconnect) and low-K dielectrics in 65nm high volume manufacturing
by
Yeoh, A.
,
Chang, M.
,
Pelto, C.
,
Tzuen-Luh Huang
,
Balakrishnan, S.
,
Leatherman, G.
,
Agraharam, S.
,
Guotao Wang
,
Zhiyong Wang
,
Chiang, D.
,
Stover, P.
,
Brandenburger, P.
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Conference Proceeding
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Meeting the heat removal requirements of 'tiled' compliant wafer level packages
by
Patel, C.S.
,
Agraharam, S.
,
Martin, K.
,
Meindll, J.D.
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