On the thermal characterization of an exposed top quad flat no-lead package

by Ma, Y.Y., Krishnamoorthi, S., Wang, C.K., Sun, A.Y.S., Zhu, W.H., Tan, H.B.

Experimental and numerical assessment of board-level temperature cycling performance for PBGA, FBGA and CSP

by Wei Sun, Zhu, W.H., Che, F.X., Wang, C.K., Sun, A.Y.S., Tan, H.B.

Electromagnetic shielding of plastic material in laser diode modules

by Chiu, S.K., Cheng, J.Y., Jou, W.S., Jong, G.J., Wang, S.C., Wang, C.M., Lin, C.S., Wu, T.L., Cheng, W.H.

High-speed differential interconnection design for flip-chip BGA packages

by Yuan, W.L., Kuah, H.P., Wang, C.K., Sun, A.Y.S., Zhu, W.H., Tan, H.B., Muhamad, A.D.

The coupling-loss characterization of an add/drop filter module in DWDM applications

by Hsieh, C.S., Wang, C.Y., Song, C.F., Cheng, W.H.

Improved Drug Delivery: Spray Freeze Dried Nano-Liposomal Inhaled Aerosols

by Zhaolin Wang, Loebenberg, R., Sweeney, L., Wong, J.P., Finlay, W.H.

Applications of ion implantation for the improvement of localized corrosion resistance of M50 bearing steel

by Wang, Y.F., Clayton, C.R., Hubler, G.K., Lucke, W.H., Hirvonen, J.K.
Published in Thin solid films

Development of Inhalable Nanoparticles

by Ely, L., Lobenberg, R., Zhaolin Wang, Yu Zhang, Finlay, W.H., Roa, W.H.Y., Sham, J.O.H.

Photoluminescence of rapid-thermal annealed Mg-doped GaN films

by Wang, L.S., Fong, W.K., Surya, C., Cheah, K.W., Zheng, W.H., Wang, Z.

Heavy-fermion behavior in CeAl2 nanoparticles

by Chen, Y.Y., Yao, Y.D., Lee, T.K., Liu, W.C., Chang, H.C., Lin, K.Y., Lin, Y.S., Wang, Z.C., Li, W.H.
Published in Nanostructured materials

Heating effects on fine structure of a Cu-Al-Ni-Mn-Ti shape memory alloy

by Zou, W.H., Peng, H.Y., Wang, R., Gui, J., Yang, D.Z.
Published in Acta metallurgica et materialia