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1by Barbara De Salvo, Gerardi, C., van Schaijk, R., Lombardo, S.A., Corso, D., Plantamura, C., Serafino, S., Ammendola, G., van Duuren, M., Goarin, P., Mei, W.Y., van der Jeugd, K., Baron, T., Gely, M., Mur, P., Deleonibus, S.Get full text
Published in IEEE transactions on device and materials reliability
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